Additive Manufacturing of Monolithic Metal RF-Components Using Metal-Binder-Jetting

Panusch D, Shi J, Gold G (2026)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2026

Pages Range: 1-4

Event location: Fukuoka, Japan JP

Abstract

This paper investigates metal-binder-jetting (MBJ) as an additive manufacturing approach for monolithic metal waveguide components for E-Band. A copper WR12 waveguide was fabricated using MBJ and compared with an investment-cast reference. Dimensional and surface characterization showed good agreement with the intended CAD model. Thus, electrical measurements from 60 GHz to 90 GHz demonstrated low insertion loss, with attenuation values of 3-4 dB/m generally better than the cast reference over large parts of the frequency band. The results indicate that metal-binder-jetting can provide a cost-effective and promising manufacturing scheme for full metal, monolithic E-Band components if design for manufacturing is addressed.

Authors with CRIS profile

David Panusch Lehrstuhl für Hochfrequenztechnik (LHFT) Jing Shi Lehrstuhl für Hochfrequenztechnik (LHFT) Gerald Gold Professur für Rechnergestützten Schaltungsentwurf

How to cite

APA:

Panusch, D., Shi, J., & Gold, G. (2026). Additive Manufacturing of Monolithic Metal RF-Components Using Metal-Binder-Jetting. In Proceedings of the 2026 Asia-Pacific Microwave Conference (APMC) (pp. 1-4). Fukuoka, Japan, JP.

MLA:

Panusch, David, Jing Shi, and Gerald Gold. "Additive Manufacturing of Monolithic Metal RF-Components Using Metal-Binder-Jetting." Proceedings of the 2026 Asia-Pacific Microwave Conference (APMC), Fukuoka, Japan 2026. 1-4.

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