Mario Sprenger

Lehrstuhl für Werkstoffwissenschaften (Werkstoffkunde und Technologie der Metalle) (WTM) Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Evaluation and improvement of the thermal performance of power modules using the Finite-Element-Method (FEM) and Multi-Material Additive Manufacturing (MMAM) (2026) Lehmann CL, Utsch D, Sprenger M, Thielen N, Franke J, Risch F, Schulze V, Zanger F Conference contribution Optimization potential in the production and end-of-life-management of electric drive units to increase resource efficiency (2026) Ihne T, Vogel A, Ockel M, Sprenger M, Hahn R, Baader M, Thielen N, et al. Conference contribution Effect of Plasma Gas onto Epoxy Mold Compound Adhesion within Heatsink Attach of Power Modules (2025) Sprenger M, Fegus M, Ockel M, Hecht C, Goth C, Franke J, Risch F Conference contribution Fabrication of copper-titanium composite layers on alumina using laser-based powder bed fusion (2025) Hecht C, Heidkamper J, Sprenger M, Frank A, Franke J, Risch F Conference contribution Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle (2024) Sippel M, Tan YF, Schmidt R, Botazzoli P, Sprenger M, Franke J Journal article Laser powder bed fusion of titanium alloyed copper powder for power electronic substrates (2024) Hecht C, Sprenger M, Franke J Conference contribution Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles (2024) Forndran F, Sprenger M, Barrera JR, Steinau M, Roellig M, Muench S Conference contribution Influence of hard encapsulation onto reliability of soldered die-attach in power modules (2024) Sprenger M, Forndran F, Öztürk B, Sippel M, Ockel M, Goth C, Franke J Conference contribution Additive metallization of alumina with copper-titanium powder blends for power electronic applications (2023) Hecht C, Häußler F, Schadow E, Stoll T, Sprenger M, Franke J Journal article Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication (2023) Utsch D, Häußler F, Sprenger M, Zirn J, Franke J Conference contribution